Eys3D Microelectronics raises $7M in Series A funding, eyes launching 3D vision modules

At a Glance

Taipei-based Eys3D Microelectronics has raised $7M from strategic investors in a Series A funding. The proceeds shall be used to build its embedded chips, AI edge sensor technology, and launch a series of 3D computer vision modules, including depth-sensing cameras, vision sensor integration, and others.

Taipei-based Eys3D Microelectronics, a company that provides 3D image capture designs and solutions, has raised $7 million in Series A funding for its AI edge sensor technology. The round was led by strategic investors, Arm IoT Capital, WI Harper Group, and Marubun Corporation.

Reports state that the proceeds shall be used to build its embedded chip business in its markets to come, grow its platform and scale up hiring. It shall also be injected into product development and the launch of a series of 3D computer vision modules that include depth-sensing cameras and vision sensor integration solutions with enhanced capabilities in object recognition, distance measurement, and much more.

Formed in 2016, Eys3D (in fact, a spin-off from Etron Technology) designs processors for AI at the edge, with the help of a silicon design approach using algorithms to integrate and manage information from different sensors. By coupling thermal, active 3D sensing, neural network perception, and other technologies, Eys3D states that its chips can power navigation, object feature depth recognition, and gesture-based commands. 

Run by a complete end-to-end computer vision platform, Eys3D’s products are being used in devices, including Facebook’s Oculus Rift S, Amazon Go stores, the Valve Index, and autonomous cleaning robots. 

Data indicates that the 3D vision market is expected to be worth $2.65 billion by 2027, at an annual growth rate of 10.2 percent. More than 4 million robots shall be installed in over 50,000 warehouses by 2025 globally, a significant jump from under 4000 warehouses in 2018.

According to Eys3D’s Special Assistant To Chief Executive Officer, James Wang, the investment coupled with rising demand for new computer vision capabilities, Eys3D is well-positioned to capture market share as and when it delves into 3D vision depth sensing.

We are well along with our roadmap in the AI-enabling market, and we are excited to continue our journey with our partners and investors that will allow Eys3D to move more computer vision products into the market

James Wang, CEO
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